ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,864, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Junya Sakai (Tokyo) and... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Semiconductor device and method... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,867, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Young Min Par... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out stacked semiconductor package s... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,869, issued on April 21, was assigned to QUALCOMM Inc. (San Diego). "Integrated circuit (IC) package employing a metal block with metal in... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,870, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manuf... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,871, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Through-dielectric vias for direc... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,873, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit package and me... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,874, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan) and SHINSHU UNIVERSITY (Matsumoto City, Japan)... Read More